Features

• High Power Handling
• Low Loss / Low Distortion
• Voltage Ratings up to 1000 Volts
• Passivated Chip for Low Leakage Current
• Low Theta (θ) Due to Full Face Chip Bonding
• Leadless Low Inductance MELF Packages
• Various Package Options
• Available as Chips
• Fully RoHS Compliant
• Non-Magnetic Packages Available for MRI

Specifications

Vr - Reverse Voltage (VDC) - MIN	50 V
Vr - Reverse Voltage (VDC) - MAX	100 V
Ct - Total Capacitance - MAX	1.2 pF
Rs - Series Resistance - MAX	750 mOhms
Rp - Parallel Resistance - MIN	5 Ohms
Vf - Forward Voltage - MAX	1 V
Tl - Carrier Lifetime - MIN	2
Operating Chip Junction Temperature	-55°C to +175°C
Operating Frequency	100 kHz to 1.5GHz
ESD	Class 1A, HBM
Package Style	MELF
Pdiss - Power Dissipation (No Heatsink)	6W
Pdiss - Power Dissipation (Infinite Heatsink)	18W
Forward BiasHarmonic Distortion R(2a/a) * R(3a/a) - MIN	80
Reverse BiasHarmonic Distortion R(2a/a) * R(3a/a) - MIN	60
Packaging	Tape & Reel

파츠스트라이크

Features

Specifications

Pin Configuration

Part Numbering System

Part Marking System

Ordering Guide

Block Diagram

관련상품